The HVC50 DC contactor can interrupt DC voltages up to 1500 V and currents up to 1000 A in under 30 milliseconds during a single event.
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The successful tape-out marks significant progress in AMD's data center CPU roadmap, with the "Venice" architecture on schedule for launch next year.
With the measurement of heart rate in wearable devices continuing to be refined for even greater precision
On the heels of announcing its 1-gamma DRAM that put a lot of emphasis on reduced power consumption, Micron Technology unveiled its 128GB small outline compression attached memory module (SOCAMM).
Infineon’s latest EDT3 IGBT chip technology is now integrated into the HybridPACK™ Drive G2 automotive power module.
As part of the program announced in October 2024, STMicroelectronics of Geneva, Switzerland has disclosed further plans to reshape its global manufacturing footprint that will “future proof our integrated device manufacturer model with strategic